Courses - Electrical Engineering & Computer Science
- EECS 411 - Microwave Circuits
- EECS 414 - Introduction to Micro Electro Mechanical Systems (MEMS)
- EECS 423 - Sold-State Device Laboratory
- EECS 425 - Integrated Microsystems Laboratory
- EECS 427 - VLSI Design 1
- EECS 514 - Advanced MEMS Devices and Technologies
- EECS 515 - Integrated Microsystems
- EECS 528 - Principles of Microelectronics Process Technology
- EECS 529 - Semiconductor Lasers and LEDs
- EECS 598-005 Solid State Lighting and Solar Cells Using Compound Semi-Conductors
EECS 411 - Microwave Circuits
Transmission-line theory, microstrip and coplanar lines, S-parameters, signal-flow graphs, matching networks, directional couplers, low-pass and band-pass filters, diode detectors. Design, fabrication, and measurements (1-10GHz) of microwave-integrated circuits using CAD tools and network analyzers.
EECS 414 - Introduction to Micro Electro Mechanical Systems (MEMS)
Micro electro mechanical systems (MEMS), devices, and technologies. Micromachining and microfabrication techniques, including planar thin-film processing, silicon etching, wafer bonding, photolithography, deposition, and etching. Transduction mechanisms and modeling in different energy domains. Analysis of micromachined capacitive, piezoresistive, and thermal sensors/actuators and applications. Computer-aided design for MEMS layout, fabrication, and analysis.
EECS 423 - Sold-State Device Laboratory
Semiconductor material and device fabrication and evaluation: diodes, bipolar and field-effect transistors, passive components. Semiconductor processing techniques: oxidation, diffusion, deposition, etching, photolithography. Lecture and laboratory. Projects to design and simulate device fabrication sequence.
EECS 425 - Integrated Microsystems Laboratory
Integrated circuit fabrication; mask design, photographic reduction; photoresist application, exposure, development, and etching; oxidation; diffusion; metal film deposition by evaporation and sputtering; die bonding, wire bonding, and encapsulation; testing of completed integrated circuits.
EECS 427 - VLSI Design 1
Design techniques for rapid implementations of very large-scale integrated (VLSI) circuits, MOS technology and logic. Structured design. Design rules, layout procedures. Design aids: layout, design rule checking, logic, and circuit simulation. Timing. Testability. Architectures for VLSI. Projects to develop and lay out circuits.
EECS 514 - Advanced MEMS Devices and Technologies
Advanced micro electro mechanical systems (MEMS) devices and technologies. Transduction techniques, including piezoelectric, electrothermal, and resonant techniques. Chemical, gas, and biological sensors, microfluidic and biomedical devices. Micromachining technologies such as laser machining and microdrilling, EDM, materials such as SiC and diamond. Sensor and actuator analysis and design through CAD.
EECS 515 - Integrated Microsystems
Review of interface electronics for sensors and drive and their influence on device performance, interface standards, MEMS and circuit noise sources, packaging and assembly techniques, testing and calibration approaches, and communication in integrated microsystems. Applications, including RF MEMS, optical MEMS, bioMEMS, and microfluidics. Design project using CAD and report preparation.
EECS 528 - Principles of Microelectronics Process Technology
Theoretical analysis of the chemistry and physics of process technologies used in micro-electronics fabrication. Topics include: semiconductor growth, material characterization, lithography tools, photo-resist models, thin film deposition, chemical etching, plasma etching, electrical contact formation, micro-structure processing, and process modeling.
EECS 529 - Semiconductor Lasers and LEDs
Optical processes in semiconductors, spontaneous emission, absorption gain, stimulated emission. Principles of light-emitting diodes, including transient effects, spectral and spatial radiation fields. Principles of semiconducting lasers; gain-current relationships, radiation fields, optical confinement and transient effects.
EECS 598-005 Solid State Lighting and Solar Cells Using Compound Semi-Conductors
Do you know that we can reduce 25% of the electricity consumption and 10% of the total energy need by replacing the old-fashioned light bulbs with highly efficient solid-state devices? Do you know solar cells with efficiency as high as 87% can be achieved if we properly engineer the compound semiconductor materials? Come and join us in discovering new applications of compound semiconductor materials in the saving and generation of energy. In this course, we will discuss the science and technology behind these increasingly important research fields. We will give an in-depth overview of the physics, materials engineering, device structures, fabrication, and circuit integration. We will put special emphasis on the design and optimization of the technology. We will focus primarily on solid-state lighting and solar cells technologies using compound semiconductor materials such as GaN, InGaP, GaAs and etc. We will mention very little on the organic materials but students who are interested in organic devices will probably still find part of this course interesting. Students who have taken EECS 529 are welcome to enroll in this class too as the overlap will be minimal. This will be the first dedicated entry-level graduate course focusing on optoelectronic technologies in energy applications. Motivated undergraduate students are highly encouraged to join us too. This course will be targeted for senior undergraduate students and graduate students. We will review relevant basics at the beginning of the class but prior background in the level of EECS 429 or equivalent is highly recommended.
Instructor: Ku,Pei-Cheng
